Partner/Owner since 2009

Representative before the EPO

Employment test 51 - 200 employees
Company dna matias erny reichl hoffmann
operating since 2009
Headquarter in Munich
active in Legal Services and IP Consulting

Tobias Erny has worked on the following 7 EPO patent applications which have been published in the last five years:

EP10851703

STORAGE DEVICE AND DATA MANAGEMENT METHOD

IPC classification:
G06F 3/06, G06F 12/00
Applicant:
Hitachi Ltd
Agent:
Tobias Erny, Matias Erny Reichl Hoffmann (MERH-IP) Patentanwälte PartG mbB
Status:
APPLICATION WITHDRAWN
EP11844936

SEMICONDUCTOR DEVICE, AND PROCESS FOR MANUFACTURE OF SEMICONDUCTOR DEVICE

IPC classification:
H01L 21/52, H01L 21/60, H01L 23/12, H01L 25/04, H01L 25/18, H05K 3/34
Applicant:
Fuji Electric Co Ltd
Agent:
Tobias Erny, Matias Erny Reichl Hoffmann (MERH-IP) Patentanwälte PartG mbB
Status:
GRANT OF PATENT INTENDED
EP11829303

LEVEL SHIFT CIRCUIT

IPC classification:
H03K 17/16, H03K 17/687, H03K 19/0185
Agent:
Tobias Erny, Matias Erny Reichl Hoffmann (MERH-IP) Patentanwälte PartG mbB
Status:
GRANT OF PATENT INTENDED
EP10849777

STORAGE CONTROL DEVICE AND CONTROL METHOD OF STORAGE CONTROL DEVICE

IPC classification:
G06F 3/06, G06F 11/07, G06F 13/10
Applicant:
Hitachi Ltd
Agent:
Tobias Erny, Matias Erny Reichl Hoffmann (MERH-IP) Patentanwälte PartG mbB
Status:
EXAMINATION IN PROGRESS
EP11713678

METHOD, APPARATUS AND SYSTEM FOR DETERMINING A POSITION OF AN OBJECT HAVING A GLOBAL NAVIGATION SATELLITE SYSTEM RECEIVER BY PROCESSING UNDIFFERENCED DATA LIKE CARRIER PHASE MEASUREMENTS AND EXTERNAL PRODUCTS LIKE IONOSPHERE DATA

IPC classification:
G01S 19/44
Applicant:
European Space Agency (ESA)
Agent:
Tobias Erny, Matias Erny Reichl Hoffmann (MERH-IP) Patentanwälte PartG mbB
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP11742020

FRACTURE SURFACE ANALYSIS SYSTEM AND METHOD OF FRACTURE SURFACE ANALYSIS

IPC classification:
G01N 3/00, G01N 3/32
Applicant:
Hitachi Ltd
Agent:
Tobias Erny, Matias Erny Reichl Hoffmann (MERH-IP) Patentanwälte PartG mbB
Status:
APPLICATION WITHDRAWN
EP11734655

FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD

IPC classification:
H01L 21/60, H01L 23/485
Applicant:
Japan Aviation Electronics Industry Limited
Agent:
Tobias Erny, Matias Erny Reichl Hoffmann (MERH-IP) Patentanwälte PartG mbB
Status:
APPLICATION WITHDRAWN

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