Jörg Wonnemann
We have observed 30 EP applications Jörg Wonnemann has served for within the last five+ years. (We consider all applications which have an EP A1 or A2 publication dated after November 18, 2014). Please note, that we only count EP applications, in which the name of the patent attorney is explicitly mentioned as representative. These EP applications are:
Method for depositing thick copper layers onto sintered materials
- IPC classification:
- H05K 3/24, C25D 5/54, C25D 5/10
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ APPLICATION DEEMED TO BE WITHDRAWN
Device for moving a substrate holder during a vertical gal-vanic metal deposition, and a method for vertical galvanic metal deposition using such a device
- IPC classification:
- C25D 21/10, C25D 17/06, C25D 5/04
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ APPLICATION DEEMED TO BE WITHDRAWN
Holding device for a substrate holder for vertical galvanic metal deposition on a substrate to be treated; and a substrate holder for being inserted in such a device
- IPC classification:
- C25D 17/08, C25D 17/06
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ APPLICATION DEEMED TO BE WITHDRAWN
Device and method for conditioning of a galvanic electrolyte and activation of electrodes prior to the start of a galvanic metal deposition process
- IPC classification:
- C25D 21/12, C25D 17/00, C25D 5/34
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ APPLICATION DEEMED TO BE WITHDRAWN
METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS
- IPC classification:
- C23C 18/20
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ NO OPPOSITION FILED WITHIN TIMELIMIT
PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES
- IPC classification:
- C23C 18/22
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ NO OPPOSITION FILED WITHIN TIMELIMIT
PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES
- IPC classification:
- C23C 18/22
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ NO OPPOSITION FILED WITHIN TIMELIMIT
Method for cathodic corrosion protection of chromium surfaces
- IPC classification:
- C25D 9/08, C25D 5/48, C25D 5/14, C23F 13/02
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ APPLICATION DEEMED TO BE WITHDRAWN
Method for treatment of recessed structures in dielectric materials for smear removal
- IPC classification:
- H05K 3/00, C23C 18/54, C23C 18/24
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ APPLICATION DEEMED TO BE WITHDRAWN
GALVANIC NICKEL OR NICKEL ALLOY ELECTROPLATING BATH FOR DEPOSITING A SEMI-BRIGHT NICKEL OR NICKEL ALLOY, METHOD FOR ELECTROPLATING AND USE OF SUCH A BATH AND COMPOUNDS FOR THE SAME
- IPC classification:
- C25D 3/56, C25D 3/18
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ PATENT GRANTED
PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES
- IPC classification:
- C23C 18/30, C23C 18/24, C23C 18/20
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ NO OPPOSITION FILED WITHIN TIMELIMIT
Method of selectively treating copper in the presence of further metal
- IPC classification:
- H05K 3/38, H05K 3/06, H01L 21/3213, C23G 1/10, C23F 1/44, C23F 1/34, C23F 1/18, C23C 18/54, C23C 18/18
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ APPLICATION DEEMED TO BE WITHDRAWN
Copper electroplating method
- IPC classification:
- H05K 3/42, C25D 7/12, C25D 5/18, C25D 5/02, C25D 3/38
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ APPLICATION DEEMED TO BE WITHDRAWN
Silver wire bonding on printed circuit boards and IC-substrates
- IPC classification:
- H05K 3/24, H01L 23/00
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ APPLICATION DEEMED TO BE WITHDRAWN
Device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition
- IPC classification:
- H05K 3/00, C25D 17/02, C25D 17/00, C25D 7/06, C23C 18/16
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ APPLICATION DEEMED TO BE WITHDRAWN
HOLDING DEVICE FOR A PRODUCT AND TREATMENT METHOD
- IPC classification:
- H01L 21/67, C25D 17/06, C25D 17/00
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ The patent has been granted
PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES
- IPC classification:
- C23C 18/30, C23C 18/28, C23C 18/24, C23C 18/22, C23C 18/16, C09K 13/04
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ EXAMINATION IN PROGRESS
DEVICE FOR VERTICAL GALVANIC METAL DEPOSITION ON A SUBSTRATE
- IPC classification:
- C25D 17/12, C25D 17/08, C25D 17/00
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ NO OPPOSITION FILED WITHIN TIMELIMIT
APPARATUS AND METHOD FOR ELECTROLYTIC DEPOSITION OF METAL LAYERS ON WORKPIECES
- IPC classification:
- C25D 21/12, C25D 17/10, C25D 17/02, C25D 17/00
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ EXAMINATION REQUESTED
ELECTROLESS COPPER PLATING SOLUTION
- IPC classification:
- C23C 18/40
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ PATENT GRANTED
Composition, use thereof and method for electrodepositing gold containing layers
- IPC classification:
- C25D 3/62, C25D 21/18, C25D 3/48
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ APPLICATION DEEMED TO BE WITHDRAWN
Acidic zinc and zinc-nickel alloy plating bath composition and electroplating method
- IPC classification:
- C25D 3/56, C25D 3/22
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ The patent has been granted
Desmear module of a horizontal process line and a method for separation and removal of desmear particles from such a desmear module
- IPC classification:
- H05K 3/00
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ The patent has been granted
Composition and method for micro etching of copper and copper alloys
- IPC classification:
- H05K 3/38, H05K 3/06, C23F 1/18
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ The patent has been granted
SUBSTRATE HOLDER FOR VERTICAL GALVANIC METAL DEPOSITION
- IPC classification:
- C25D 17/06, C25D 17/00
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ The patent has been granted
TREATING MODULE OF AN APPARATUS FOR HORIZONTAL WET-CHEMICAL TREATMENT OF LARGE-SCALE SUBSTRATES
- IPC classification:
- H01L 21/677, H01L 21/67
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ PATENT GRANTED
Plating bath compositions for electroless plating of metals and metal alloys
- IPC classification:
- C23C 18/50, C23C 18/48, C23C 18/40, C23C 18/36, C23C 18/34
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ PATENT GRANTED
Trench pattern wet chemical copper metal filling using a hard mask structure
- IPC classification:
- H01L 21/288, C23C 18/40, C23C 18/16, C25D 5/48, C25D 5/02, C25D 3/38, C25D 7/12
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ APPLICATION DEEMED TO BE WITHDRAWN
Method for fine line manufacturing
- IPC classification:
- H01L 21/768, H01L 21/288, H01L 21/285, H01L 21/283, G03F 7/11, G03F 7/095, G03F 7/09, G03F 7/20
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ EXAMINATION REQUESTED
Method for increasing adhesion between a chromium surface and a lacquer
- IPC classification:
- C09D 7/00, C23C 28/00
- Applicant:
- Atotech Deutschland GmbH
- Agent:
- Jörg Wonnemann, Atotech Deutschland GmbH
- Status:
- █ PATENT GRANTED