Representative before the EPO

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Jörg Wonnemann has worked on the following 72 EPO patent applications which have been published in the last five years:

EP11707007

CHROMIUM -FREE PASSIVATION PROCESS OF VAPOR DEPOSITED ALUMINUM SURFACES

IPC classification:
C23C 14/16, C23C 14/24, C23C 14/58, C23C 16/20, C23C 16/448, C23C 16/56, C23C 22/34, C23C 22/83, C23C 28/00
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP11723436

METHOD FOR ETCHING OF COPPER AND COPPER ALLOYS

IPC classification:
C23F 1/18
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION IN PROGRESS
EP10854524

METHODS OF TREATING METAL SURFACES AND DEVICES FORMED THEREBY

IPC classification:
B05D 3/00
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION REQUESTED
EP11737966

METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON SUBSTRATES

IPC classification:
H05K 3/24, H05K 3/34, H05K 3/40
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION IN PROGRESS
EP11175295

Electroless nickel plating bath composition

IPC classification:
C23C 18/36
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP12719380

METHOD FOR COPPER PLATING

IPC classification:
C25D 3/38
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP12730564

METHOD FOR PROVIDING ORGANIC RESIST ADHESION TO A COPPER OR COPPER ALLOY SURFACE

IPC classification:
C23C 22/52, C23F 1/18, H05K 3/38
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP12194261

Copper plating bath composition

IPC classification:
C25D 3/38, C25D 3/58
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP12075036

Method for promoting adhesion between dielectric substrates and metal layers

IPC classification:
C23C 18/20
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION WITHDRAWN
EP12743909

ELECTROLESS NICKEL PLATING BATH COMPOSITION

IPC classification:
C23C 18/36
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP11191974

Novel adhesion promoting agents for metallization of substrate surfaces

IPC classification:
C23C 18/12, C23C 18/16, C23C 18/18, C23C 18/20, C25D 5/54
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP11192516

Multilayer printed circuit board manufacture

IPC classification:
H05K 3/06, H05K 3/38
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP12075142

Device for vertical galvanic metal deposition on a substrate

IPC classification:
C25D 17/00, C25D 17/08, C25D 17/12
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13155083

Method for depositing a first metallic layer onto non-conductive polymers

IPC classification:
C23C 18/22, C23C 18/30, C23C 18/32
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION REQUESTED
EP12180227

Plating bath composition for immersion plating of gold

IPC classification:
C23C 18/54
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
GRANT OF PATENT INTENDED
EP12185004

Manufacture of coated copper pillars

IPC classification:
H01L 21/60, H01L 23/485
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
GRANT OF PATENT INTENDED
EP12195672

Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes

IPC classification:
C23C 18/16, C23C 18/18, C23C 18/44, C23C 18/54
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP12184514

Method for metallization of solar cell substrates

IPC classification:
H01L 31/0224, H01L 31/18
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13161011

Process for corrosion protection of iron containing materials

IPC classification:
C25D 3/56, C25D 5/10, C25D 5/14, C25D 5/48
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP13160785

Method for activating a copper surface for electroless plating

IPC classification:
C23C 18/18, H01L 21/288, H05K 3/24
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP11179937

Direct plating method

IPC classification:
H05K 3/42
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP12159654

Method for metallising non-conductive plastic surfaces

IPC classification:
C23C 18/22
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP12805956

METHOD FOR COMBINED THROUGH-HOLE PLATING AND VIA FILLING

IPC classification:
C23C 18/16, C25D 3/38, C25D 5/18, H01L 21/288, H05K 3/42
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP12159659

Method for metallising non-conductive plastic surfaces

IPC classification:
C23C 18/22
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP12159652

Method for metallising non-conductive plastic surfaces

IPC classification:
C23C 18/22
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13167074

Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy

IPC classification:
C25D 3/18, C25D 3/56
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13075031

Method for depositing thick copper layers onto sintered materials

IPC classification:
C25D 5/10, C25D 5/54, H05K 3/24
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13704088

COMPOSITION AND METHOD FOR REMOVAL OF ORGANIC PAINT COATINGS FROM SUBSTRATES

IPC classification:
C09D 9/00
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13171962

Holding device for a substrate holder for vertical galvanic metal deposition on a substrate to be treated; and a substrate holder for being inserted in such a device

IPC classification:
C25D 17/06, C25D 17/08
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13171963

Device for moving a substrate holder during a vertical gal-vanic metal deposition, and a method for vertical galvanic metal deposition using such a device

IPC classification:
C25D 5/04, C25D 17/06, C25D 21/10
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13151243

Aqueous composition for etching of copper and copper alloys

IPC classification:
C23C 22/52, C23F 1/02, C23F 1/18, C23F 1/46, H05K 3/06, H05K 3/38
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13175010

Device and method for conditioning of a galvanic electrolyte and activation of electrodes prior to the start of a galvanic metal deposition process

IPC classification:
C25D 5/34, C25D 17/00, C25D 21/12
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13710864

METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS

IPC classification:
C23C 18/20
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13709443

PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES

IPC classification:
C23C 18/22
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13709442

PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES

IPC classification:
C23C 18/22
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13177307

Method for cathodic corrosion protection of chromium surfaces

IPC classification:
C23F 13/02, C25D 5/14, C25D 5/48, C25D 9/08
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13164188

Functional chromium layer with improved corrosion resistance

IPC classification:
C25D 3/10, C25D 3/56, C25D 17/10
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP12075143

Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device

IPC classification:
C25D 17/00, C25D 17/08, C25D 17/12, H01L 21/768
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13151680

Plated electrical contacts for solar modules

IPC classification:
H01L 23/538, H01L 31/05
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
GRANT OF PATENT INTENDED
EP13185890

Method for treatment of recessed structures in dielectric materials for smear removal

IPC classification:
C23C 18/24, C23C 18/54, H05K 3/00
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP14711278

GALVANIC NICKEL OR NICKEL ALLOY ELECTROPLATING BATH FOR DEPOSITING A SEMI-BRIGHT NICKEL OR NICKEL ALLOY, METHOD FOR ELECTROPLATING AND USE OF SUCH A BATH AND COMPOUNDS FOR THE SAME

IPC classification:
C25D 3/18, C25D 3/56
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP13727595

PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES

IPC classification:
C23C 18/20, C23C 18/24, C23C 18/30
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13189523

Method of selectively treating copper in the presence of further metal

IPC classification:
C23C 18/18, C23C 18/54, C23F 1/18, C23F 1/34, C23F 1/44, C23G 1/10, H01L 21/3213, H05K 3/06, H05K 3/38
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13189652

Copper electroplating method

IPC classification:
C25D 3/38, C25D 5/02, C25D 5/18, C25D 7/12, H05K 3/42
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP11799425

METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BONDING ON PRINTED CIRCUIT BOARDS AND IC-SUBSTRATES

IPC classification:
H01L 23/498, H05K 3/24
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13198900

Silver wire bonding on printed circuit boards and IC-substrates

IPC classification:
H01L 23/00, H05K 3/24
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13198968

Device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition

IPC classification:
C23C 18/16, C25D 7/06, C25D 17/00, C25D 17/02, H05K 3/00
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13765337

HOLDING DEVICE FOR A PRODUCT AND TREATMENT METHOD

IPC classification:
C25D 17/00, C25D 17/06, H01L 21/67
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION IN PROGRESS
EP13799621

PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES

IPC classification:
C09K 13/04, C23C 18/16, C23C 18/22, C23C 18/24, C23C 18/28, C23C 18/30
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION IN PROGRESS
EP13801546

DEVICE FOR VERTICAL GALVANIC METAL DEPOSITION ON A SUBSTRATE

IPC classification:
C25D 17/00, C25D 17/08, C25D 17/12
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP12170693

Plating bath for electroless deposition of nickel layers

IPC classification:
C23C 18/34, C23C 18/50, H01L 21/288
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP14714193

APPARATUS AND METHOD FOR ELECTROLYTIC DEPOSITION OF METAL LAYERS ON WORKPIECES

IPC classification:
C25D 17/00, C25D 17/02, C25D 17/10, C25D 21/12
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION REQUESTED
EP14714648

ELECTROLESS COPPER PLATING SOLUTION

IPC classification:
C23C 18/40
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP12152390

Method for producing matt copper deposits

IPC classification:
C25D 3/38, C25D 5/10
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP14182083

Composition, use thereof and method for electrodepositing gold containing layers

IPC classification:
C25D 3/48, C25D 3/62, C25D 21/18
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP12075035

Method for manufacture of fine line circuitry

IPC classification:
C25D 5/02, C25D 5/54, H05K 3/10, H05K 3/38, H05K 3/42, H05K 3/46
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP12155801

Method for electroless nickel-phosphorous alloy deposition onto flexible substrates

IPC classification:
C23C 18/36, H05K 3/24
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP12703030

ALKALINE AQUEOUS ZINC-IRON ALLOY PLATING BATH AND METHOD USING THE SAME

IPC classification:
B32B 15/01, C25D 3/56, C25D 5/48
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP14190510

Acidic zinc and zinc-nickel alloy plating bath composition and electroplating method

IPC classification:
C25D 3/22, C25D 3/56
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION IN PROGRESS
EP14190815

Desmear module of a horizontal process line and a method for separation and removal of desmear particles from such a desmear module

IPC classification:
H05K 3/00
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
GRANT OF PATENT INTENDED
EP10721503

PROCESS FOR FORMING CORROSION PROTECTION LAYERS ON METAL SURFACES

IPC classification:
C23C 22/06, C23C 22/12, C23C 22/17, C23C 22/20, C23C 22/60, C23C 22/73, C23C 22/77, C23C 22/82, C23C 22/83, C25D 3/00, C25D 3/02, C25D 11/00, C25D 11/38
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP14199223

Composition and method for micro etching of copper and copper alloys

IPC classification:
C23F 1/18, H05K 3/06, H05K 3/38
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION REQUESTED
EP14199449

SUBSTRATE HOLDER FOR VERTICAL GALVANIC METAL DEPOSITION

IPC classification:
C25D 17/00, C25D 17/06
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION REQUESTED
EP14199222

TREATING MODULE OF AN APPARATUS FOR HORIZONTAL WET-CHEMICAL TREATMENT OF LARGE-SCALE SUBSTRATES

IPC classification:
H01L 21/67, H01L 21/677
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP14198380

Plating bath compositions for electroless plating of metals and metal alloys

IPC classification:
C23C 18/34, C23C 18/36, C23C 18/40, C23C 18/48, C23C 18/50
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP14199374

Trench pattern wet chemical copper metal filling using a hard mask structure

IPC classification:
C23C 18/16, C23C 18/40, C25D 3/38, C25D 5/02, C25D 5/48, C25D 7/12, H01L 21/288
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP14198263

Method for fine line manufacturing

IPC classification:
G03F 7/09, G03F 7/095, G03F 7/11, G03F 7/20, H01L 21/283, H01L 21/285, H01L 21/288, H01L 21/768
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION REQUESTED
EP15150950

Method for increasing adhesion between a chromium surface and a lacquer

IPC classification:
C09D 7/00, C23C 28/00
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP11760829

PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV), WITH HEATED SUBSTRATE AND COOLED ELECTROLYTE

IPC classification:
C25D 3/38, C25D 5/00, C25D 7/12, C25D 17/00, C25D 21/02, H01L 21/288, H01L 21/768
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP11189954

Aqueous composition for etching of copper and copper alloys

IPC classification:
C23F 1/18, C23F 1/44, C23F 1/46, H01L 21/3213, H05K 3/06, H05K 3/10
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP11184919

ELECTROLESS PALLADIUM PLATING BATH COMPOSITION

IPC classification:
C23C 18/44
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP12159365

Alkaline plating bath for electroless deposition of cobalt alloys

IPC classification:
C23C 18/50, H01L 21/288
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT

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