Representative before the EPO

Technology company logo thumb
no operation time available
1 office
Technology Company

We have observed 75 EP applications Jörg Wonnemann has served for within the last five+ years. (We consider all applications which have an EP A1 publication dated after December 17, 2012). Please note, that we only count EP applications, in which the name of the patent attorney is explicitly mentioned as representative. These EP applications are:

EP11707007

CHROMIUM -FREE PASSIVATION PROCESS OF VAPOR DEPOSITED ALUMINUM SURFACES

IPC classification:
C23C 14/16, C23C 14/24, C23C 14/58, C23C 16/20, C23C 16/448, C23C 16/56, C23C 22/34, C23C 22/83, C23C 28/00
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP11723436

METHOD FOR ETCHING OF COPPER AND COPPER ALLOYS

IPC classification:
C23F 1/18
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION IN PROGRESS
EP11169737

Wire bondable surface for microelectronic devices

IPC classification:
H01L 23/485
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION IN PROGRESS
EP10854524

METHODS OF TREATING METAL SURFACES AND DEVICES FORMED THEREBY

IPC classification:
B05D 3/00
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION REQUESTED
EP11737966

METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON SUBSTRATES

IPC classification:
H05K 3/24, H05K 3/34, H05K 3/40
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION IN PROGRESS
EP11171055

Method for copper plating

IPC classification:
C25D 3/38
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP11169738

Copper filled opening with a cap layer

IPC classification:
C23C 18/16, C23C 18/31, C23C 18/32, H01L 21/768, H01L 23/532
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION WITHDRAWN
EP11175295

Electroless nickel plating bath composition

IPC classification:
C23C 18/36
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP12719380

METHOD FOR COPPER PLATING

IPC classification:
C25D 3/38
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP12730564

METHOD FOR PROVIDING ORGANIC RESIST ADHESION TO A COPPER OR COPPER ALLOY SURFACE

IPC classification:
C23C 22/52, C23F 1/18, H05K 3/38
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP12194261

Copper plating bath composition

IPC classification:
C25D 3/38, C25D 3/58
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP12075036

Method for promoting adhesion between dielectric substrates and metal layers

IPC classification:
C23C 18/20
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION WITHDRAWN
EP12743909

ELECTROLESS NICKEL PLATING BATH COMPOSITION

IPC classification:
C23C 18/36
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP11191974

Novel adhesion promoting agents for metallization of substrate surfaces

IPC classification:
C23C 18/12, C23C 18/16, C23C 18/18, C23C 18/20, C25D 5/54
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP11192516

Multilayer printed circuit board manufacture

IPC classification:
H05K 3/06, H05K 3/38
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP12075142

Device for vertical galvanic metal deposition on a substrate

IPC classification:
C25D 17/00, C25D 17/08, C25D 17/12
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13155083

Method for depositing a first metallic layer onto non-conductive polymers

IPC classification:
C23C 18/22, C23C 18/30, C23C 18/32
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION REQUESTED
EP12180227

Plating bath composition for immersion plating of gold

IPC classification:
C23C 18/54
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
GRANT OF PATENT INTENDED
EP12185004

Manufacture of coated copper pillars

IPC classification:
H01L 21/60, H01L 23/485
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
GRANT OF PATENT INTENDED
EP12195672

Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes

IPC classification:
C23C 18/16, C23C 18/18, C23C 18/44, C23C 18/54
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP12184514

Method for metallization of solar cell substrates

IPC classification:
H01L 31/0224, H01L 31/18
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13161011

Process for corrosion protection of iron containing materials

IPC classification:
C25D 3/56, C25D 5/10, C25D 5/14, C25D 5/48
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP13160785

Method for activating a copper surface for electroless plating

IPC classification:
C23C 18/18, H01L 21/288, H05K 3/24
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP11179937

Direct plating method

IPC classification:
H05K 3/42
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP12159654

Method for metallising non-conductive plastic surfaces

IPC classification:
C23C 18/22
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP12805956

METHOD FOR COMBINED THROUGH-HOLE PLATING AND VIA FILLING

IPC classification:
C23C 18/16, C25D 3/38, C25D 5/18, H01L 21/288, H05K 3/42
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP12159659

Method for metallising non-conductive plastic surfaces

IPC classification:
C23C 18/22
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP12159652

Method for metallising non-conductive plastic surfaces

IPC classification:
C23C 18/22
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13167074

Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy

IPC classification:
C25D 3/18, C25D 3/56
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13075031

Method for depositing thick copper layers onto sintered materials

IPC classification:
C25D 5/10, C25D 5/54, H05K 3/24
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13704088

COMPOSITION AND METHOD FOR REMOVAL OF ORGANIC PAINT COATINGS FROM SUBSTRATES

IPC classification:
C09D 9/00
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13171962

Holding device for a substrate holder for vertical galvanic metal deposition on a substrate to be treated; and a substrate holder for being inserted in such a device

IPC classification:
C25D 17/06, C25D 17/08
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13171963

Device for moving a substrate holder during a vertical gal-vanic metal deposition, and a method for vertical galvanic metal deposition using such a device

IPC classification:
C25D 5/04, C25D 17/06, C25D 21/10
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13151243

Aqueous composition for etching of copper and copper alloys

IPC classification:
C23C 22/52, C23F 1/02, C23F 1/18, C23F 1/46, H05K 3/06, H05K 3/38
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13175010

Device and method for conditioning of a galvanic electrolyte and activation of electrodes prior to the start of a galvanic metal deposition process

IPC classification:
C25D 5/34, C25D 17/00, C25D 21/12
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13710864

METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS

IPC classification:
C23C 18/20
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13709443

PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES

IPC classification:
C23C 18/22
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13709442

PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES

IPC classification:
C23C 18/22
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13177307

Method for cathodic corrosion protection of chromium surfaces

IPC classification:
C23F 13/02, C25D 5/14, C25D 5/48, C25D 9/08
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13164188

Functional chromium layer with improved corrosion resistance

IPC classification:
C25D 3/10, C25D 3/56, C25D 17/10
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP12075143

Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device

IPC classification:
C25D 17/00, C25D 17/08, C25D 17/12, H01L 21/768
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13151680

Plated electrical contacts for solar modules

IPC classification:
H01L 23/538, H01L 31/05
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
GRANT OF PATENT INTENDED
EP13185890

Method for treatment of recessed structures in dielectric materials for smear removal

IPC classification:
C23C 18/24, C23C 18/54, H05K 3/00
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP14711278

GALVANIC NICKEL OR NICKEL ALLOY ELECTROPLATING BATH FOR DEPOSITING A SEMI-BRIGHT NICKEL OR NICKEL ALLOY, METHOD FOR ELECTROPLATING AND USE OF SUCH A BATH AND COMPOUNDS FOR THE SAME

IPC classification:
C25D 3/18, C25D 3/56
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP13727595

PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES

IPC classification:
C23C 18/20, C23C 18/24, C23C 18/30
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP13189523

Method of selectively treating copper in the presence of further metal

IPC classification:
C23C 18/18, C23C 18/54, C23F 1/18, C23F 1/34, C23F 1/44, C23G 1/10, H01L 21/3213, H05K 3/06, H05K 3/38
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13189652

Copper electroplating method

IPC classification:
C25D 3/38, C25D 5/02, C25D 5/18, C25D 7/12, H05K 3/42
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP11799425

METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BONDING ON PRINTED CIRCUIT BOARDS AND IC-SUBSTRATES

IPC classification:
H01L 23/498, H05K 3/24
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13198900

Silver wire bonding on printed circuit boards and IC-substrates

IPC classification:
H01L 23/00, H05K 3/24
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13198968

Device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition

IPC classification:
C23C 18/16, C25D 7/06, C25D 17/00, C25D 17/02, H05K 3/00
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP13765337

HOLDING DEVICE FOR A PRODUCT AND TREATMENT METHOD

IPC classification:
C25D 17/00, C25D 17/06, H01L 21/67
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION IN PROGRESS
EP13799621

PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES

IPC classification:
C09K 13/04, C23C 18/16, C23C 18/22, C23C 18/24, C23C 18/28, C23C 18/30
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION IN PROGRESS
EP13801546

DEVICE FOR VERTICAL GALVANIC METAL DEPOSITION ON A SUBSTRATE

IPC classification:
C25D 17/00, C25D 17/08, C25D 17/12
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP12170693

Plating bath for electroless deposition of nickel layers

IPC classification:
C23C 18/34, C23C 18/50, H01L 21/288
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP14714193

APPARATUS AND METHOD FOR ELECTROLYTIC DEPOSITION OF METAL LAYERS ON WORKPIECES

IPC classification:
C25D 17/00, C25D 17/02, C25D 17/10, C25D 21/12
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION REQUESTED
EP14714648

ELECTROLESS COPPER PLATING SOLUTION

IPC classification:
C23C 18/40
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP12152390

Method for producing matt copper deposits

IPC classification:
C25D 3/38, C25D 5/10
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP14182083

Composition, use thereof and method for electrodepositing gold containing layers

IPC classification:
C25D 3/48, C25D 3/62, C25D 21/18
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP12075035

Method for manufacture of fine line circuitry

IPC classification:
C25D 5/02, C25D 5/54, H05K 3/10, H05K 3/38, H05K 3/42, H05K 3/46
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP12155801

Method for electroless nickel-phosphorous alloy deposition onto flexible substrates

IPC classification:
C23C 18/36, H05K 3/24
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP12703030

ALKALINE AQUEOUS ZINC-IRON ALLOY PLATING BATH AND METHOD USING THE SAME

IPC classification:
B32B 15/01, C25D 3/56, C25D 5/48
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP14190510

Acidic zinc and zinc-nickel alloy plating bath composition and electroplating method

IPC classification:
C25D 3/22, C25D 3/56
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION IN PROGRESS
EP14190815

Desmear module of a horizontal process line and a method for separation and removal of desmear particles from such a desmear module

IPC classification:
H05K 3/00
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
The patent has been granted
EP10721503

PROCESS FOR FORMING CORROSION PROTECTION LAYERS ON METAL SURFACES

IPC classification:
C23C 22/06, C23C 22/12, C23C 22/17, C23C 22/20, C23C 22/60, C23C 22/73, C23C 22/77, C23C 22/82, C23C 22/83, C25D 3/00, C25D 3/02, C25D 11/00, C25D 11/38
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP14199223

Composition and method for micro etching of copper and copper alloys

IPC classification:
C23F 1/18, H05K 3/06, H05K 3/38
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
The patent has been granted
EP14199449

SUBSTRATE HOLDER FOR VERTICAL GALVANIC METAL DEPOSITION

IPC classification:
C25D 17/00, C25D 17/06
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION REQUESTED
EP14199222

TREATING MODULE OF AN APPARATUS FOR HORIZONTAL WET-CHEMICAL TREATMENT OF LARGE-SCALE SUBSTRATES

IPC classification:
H01L 21/67, H01L 21/677
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP14198380

Plating bath compositions for electroless plating of metals and metal alloys

IPC classification:
C23C 18/34, C23C 18/36, C23C 18/40, C23C 18/48, C23C 18/50
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP14199374

Trench pattern wet chemical copper metal filling using a hard mask structure

IPC classification:
C23C 18/16, C23C 18/40, C25D 3/38, C25D 5/02, C25D 5/48, C25D 7/12, H01L 21/288
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
APPLICATION DEEMED TO BE WITHDRAWN
EP14198263

Method for fine line manufacturing

IPC classification:
G03F 7/09, G03F 7/095, G03F 7/11, G03F 7/20, H01L 21/283, H01L 21/285, H01L 21/288, H01L 21/768
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
EXAMINATION REQUESTED
EP15150950

Method for increasing adhesion between a chromium surface and a lacquer

IPC classification:
C09D 7/00, C23C 28/00
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP11760829

PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV), WITH HEATED SUBSTRATE AND COOLED ELECTROLYTE

IPC classification:
C25D 3/38, C25D 5/00, C25D 7/12, C25D 17/00, C25D 21/02, H01L 21/288, H01L 21/768
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP11189954

Aqueous composition for etching of copper and copper alloys

IPC classification:
C23F 1/18, C23F 1/44, C23F 1/46, H01L 21/3213, H05K 3/06, H05K 3/10
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT
EP11184919

ELECTROLESS PALLADIUM PLATING BATH COMPOSITION

IPC classification:
C23C 18/44
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
PATENT GRANTED
EP12159365

Alkaline plating bath for electroless deposition of cobalt alloys

IPC classification:
C23C 18/50, H01L 21/288
Applicant:
Atotech Deutschland GmbH
Agent:
Jörg Wonnemann, Atotech Deutschland GmbH
Status:
NO OPPOSITION FILED WITHIN TIMELIMIT

Please Sign in to use this feature