Priority Date: 13.06.16 (US 201615181212)

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-MOLD COOLING CHANNEL

  • Application ID: EP17813820
  • Status: Request for examination was made

Applicant

Technology company logo small
Technology Company

Attorney

Employment test 51 - 200 employees
Company dna carpmarls and ransford
operating since 1848
Headquarter in London and 2 offices
active in Legal Services and IP Consulting

Specialization

This EP application has the IPC class H01 (BASIC ELECTRIC ELEMENTS). Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 13.06.2016 - Priority Date (US 201615181212)
  • 21.12.2017 - Publication A1 (WO2017218290)
  • 17.04.2019 - Publication A1 (EP3469628)

IPC Classification