MOLDED CIRCUIT BOARD OF CAMERA MODULE, MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD FOR MOLDED CIRCUIT BOARD
- Application ID: EP17809705
- Status: █ Request for examination was made
This EP application has the IPC combination H04 (ELECTRIC COMMUNICATION TECHNIQUE) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). CocreateIP is specialized in the combination H04 and H05. We found, that AWA, 2K Patentanwälte Blasberg Kewitz & Reichel Partnerschaft mbB, Mitscherlich PartmbB, Groth & Co KB, Dogio Patents BV and 6 others are specialized in all of these IPC classes as well. For a similar patent, they might be a good choice.