SOLDER COMPOSITION AND METHOD OF SOLDERING

  • Application ID: EP17204195
  • Status: The application has been published

Attorney

operating since 2009
1186.01
Headquarter in London and 4 offices
active in Legal Services and IP Consulting

Specialization

This EP application has the IPC combination B23, C08, and H05. There is no patent agent firm in the market, which is specialized in this combination of IPC classes.

Timeline

  • 29.05.2019 - Publication A1 (EP3488962)