Priority Date: 15.01.15 (DE 20151000450)

SEPARATING DEVICE FOR THE CHIP-FREE CUTTING OF WAFERS OF DONOR SUBSTRATES

  • Application ID: EP16700575
  • Status: Request for examination was made

Applicant

Technology company logo small
Technology Company

Attorneys

operating since 1997
Headquarter in Munich
active in Legal Services
Employment test 11 - 50 employees
Company dna westphal mussgnug and partner
operating since 1952
Headquarter in Villingen-Schwenningen and 1 office
active in Legal Services

Specialization

This EP application has the IPC combination B28 (WORKING CEMENT, CLAY, OR STONE) and H01 (BASIC ELECTRIC ELEMENTS). Kehl Ascherl Liebhoff & Ettmayr is specialized in the combination B28 and H01. We found, that Patentbüro Paul Rosenich AG, Wynne-Jones Lainé & James LLP, Dr. Langfinger & Partner Partnerschaft mbB are specialized in all of these IPC classes as well. For a similar patent, they might be a good choice.

Timeline

  • 15.01.2015 - Priority Date (DE 20151000450)
  • 21.07.2016 - Publication A1 (WO2016113311)
  • 22.11.2017 - Publication A1 (EP3245034)

IPC Classification