SEPARATING DEVICE FOR THE CHIP-FREE CUTTING OF WAFERS OF DONOR SUBSTRATES
- Application ID: EP16700575
- Status: █ Request for examination was made
This EP application has the IPC combination B28 (WORKING CEMENT, CLAY, OR STONE) and H01 (BASIC ELECTRIC ELEMENTS). Kehl Ascherl Liebhoff & Ettmayr is specialized in the combination B28 and H01. We found, that Patentbüro Paul Rosenich AG, Wynne-Jones Lainé & James LLP, Dr. Langfinger & Partner Partnerschaft mbB are specialized in all of these IPC classes as well. For a similar patent, they might be a good choice.