LEAD-FREE SOLDER ALLOY COMPRISING SN, BI AND AT LEAST ONE OF P, MN, CU, ZN, SB AND ITS USE FOR SOLDERING AN ELECTRONIC COMPONENT TO A SUBSTRATE

  • Application ID: EP16188368
  • Status: Request for examination was made

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Specialization

This EP application has the IPC combination B23, C22, and H05. We found, that Heraeus Holding GmbH is specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 14.03.2018 - Publication A1 (EP3292943)