Priority Date: 06.05.14 (EP 20140167101)
ULTRASONIC TRANSDUCER CHIP ASSEMBLY, ULTRASOUND PROBE, ULTRASONIC IMAGING SYSTEM AND ULTRASOUND ASSEMBLY AND PROBE MANUFACTURING METHODS
- Application ID: EP15719238
- Status: █ The patent has been granted
Applicant
Technology Company
Attorney
Specialization
This EP application has the IPC combination B06 (GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL) and G10 (MUSICAL INSTRUMENTS; ACOUSTICS). We found, that Esaote SpA is specialized in this combination either. For a similar patent, they might be a good choice.
Timeline
- 06.05.2014 - Priority Date (EP 20140167101)
- 12.11.2015 - Publication A1 (WO2015169771)
- 15.03.2017 - Publication A1 (EP3140049)
- 01.08.2018 - Publication B1 (EP3140049)