Priority Date: 20.03.14 (US 201414220913)

FACE-UP SUBSTRATE INTEGRATION WITH SOLDER BALL CONNECTION IN SEMICONDUCTOR PACKAGE

  • Application ID: EP15711626
  • Status: EXAMINATION REQUESTED

Applicant

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Technology Company

Attorney

operating since 1937
1313.72
10 offices
active in Legal Services and IP Consulting

Specialization

This EP application has the IPC combination H01 (BASIC ELECTRIC ELEMENTS) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). We found, that Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte, AWA, Grünecker Patent- und Rechtsanwälte PartG mbB, advotec., M. Zardi & CO SA and 40 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 20.03.2014 - Priority Date (US 201414220913)
  • 24.09.2015 - Publication A1 (WO2015142591)
  • 25.01.2017 - Publication A1 (EP3120674)