Priority Date: 28.09.09 (JP 20090223344)

Pressuring module, pressuring apparatus, and substrate bonding apparatus

  • Application ID: EP15150438
  • Status: GRANT OF PATENT INTENDED

Applicant

Technology company logo small
Technology Company

Attorney

Employment test 51 - 200 employees
Company dna hoffmann eitle
operating since 1892
Headquarter in Munich and 4 offices
active in Legal Services and IP Portfolio Processing

Specialization

This patent has the IPC class H01 (BASIC ELECTRIC ELEMENTS) Hoffmann Eitle PartmbB is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 28.09.2009 - Priority Date (JP 20090223344)
  • 03.06.2015 - Publication A1 (EP2879163)

IPC Classification