Priority Date: 01.09.10 (GB 20100014557)

Soldering nozzle for delivering molten solder to the underside of a pcb

  • Application ID: EP15150194
  • Status: PATENT GRANTED

Attorney

operating since 1887
Headquarter in London and 16 offices
active in Legal Services, IP Consulting, and Matchmaking and Trading

Specialization

This EP application has the IPC class B23, F23, and H05. There is no patent agent firm in the market, which is specialized in this combination of IPC classes.

Timeline

  • 01.09.2010 - Priority Date (GB 20100014557)
  • 17.06.2015 - Publication A1 (EP2883642)
  • 23.11.2016 - Publication B1 (EP2883642)