Priority Date: 01.09.10 (GB 20100014557)

Soldering nozzle for delivering molten solder to the underside of a pcb

  • Application ID: EP15150194
  • Status: PATENT GRANTED

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Specialization

This patent has the IPC combination B23, F23, and H05 is specialized in the combination B23, F23, and H05. There is no patent agent firm in the market, which is specialized in this combination of IPC classes.

Timeline

  • 01.09.2010 - Priority Date (GB 20100014557)
  • 17.06.2015 - Publication A1 (EP2883642)
  • 23.11.2016 - Publication B1 (EP2883642)