Systems and methods for coupling a semiconductor device of an automation device to a heat sink
- Application ID: EP15150014
- Status: █ EXAMINATION REQUESTED
This EP application has the IPC class F16 (ENGINEERING ELEMENTS OR UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Ilberg & Weißfloh, Schweiger & Partners, Keller & Partner Patentanwälte AG, Dr. Graf & Partner AG, Bauer Vorberg Kayser mbB and 75 others are specialized in this combination either. For a similar patent, they might be a good choice.