COMBINED WAFER PRODUCTION METHOD WITH LASER TREATMENT AND TEMPERATURE-INDUCED STRESSES
- Application ID: EP14781231
- Status: █ GRANT OF PATENT INTENDED
This EP application has the IPC combination B23, B28, and H01. Kehl Ascherl Liebhoff & Ettmayr is specialized in the combination B23, B28, and H01. We found, that Patentbüro Paul Rosenich AG is specialized in all of these IPC classes as well. For a similar patent, they might be a good choice.