Composition and method for micro etching of copper and copper alloys

  • Application ID: EP14199223
  • Status: The patent has been granted


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This EP application has the IPC combination C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). Atotech Deutschland GmbH is specialized in the combination C23 and H05. We found, that Gihske Große Klüppel Kross, Yeadon IP Ltd, Heraeus Holding GmbH, Chemetall GmbH, Patentanwaltskanzlei Scheffler and 2 others are specialized in all of these IPC classes as well. For a similar patent, they might be a good choice.


  • 22.06.2016 - Publication A1 (EP3034654)
  • 25.10.2017 - Publication B1 (EP3034654)

IPC Classification