Priority Date: 17.12.13 (JP 20130260556)

Resin lapping plate and lapping method using the same

  • Application ID: EP14197460
  • Status: PATENT GRANTED

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Specialization

This EP application has the IPC combination B24 (GRINDING; POLISHING) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Zimmermann & Partner Patentanwälte mbB, Durm & Partner, Innovincia, Nash Matthews LLP are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 17.12.2013 - Priority Date (JP 20130260556)
  • 24.06.2015 - Publication A1 (EP2886249)
  • 22.06.2016 - Publication B1 (EP2886249)

IPC Classification