Resin lapping plate and lapping method using the same
- Application ID: EP14197460
- Status: █ PATENT GRANTED
This EP application has the IPC combination B24 (GRINDING; POLISHING) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Zimmermann & Partner Patentanwälte mbB, Durm & Partner, Innovincia, Nash Matthews LLP are specialized in this combination either. For a similar patent, they might be a good choice.