Priority Date: 19.12.13 (DE 201310226683)

Method for producing cavities or backcuts in a multilayer circuit board

  • Application ID: EP14195334
  • Status: GRANT OF PATENT INTENDED

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Specialization

This patent has the IPC class H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR) is specialized in H05. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 19.12.2013 - Priority Date (DE 201310226683)
  • 24.06.2015 - Publication A1 (EP2887780)

IPC Classification