Electronic device incorporating a randomized interconnection layer
- Application ID: EP14192633
- Status: █ EXAMINATION IN PROGRESS
This EP application has the IPC combination G06, H01, and H04. NXP Semiconductors UK Ltd is specialized in the combination G06, H01, and H04. We found, that Boehmert & Boehmert Anwaltspartnerschaft mbB, Becker Kurig Straus, Betten & Resch Patent- und Rechtsanwälte PartGmbB, Westphal Mussgnug & Partner, Epping Hermann Fischer Patentanwaltsgesellschaft mbH and 19 others are specialized in all of these IPC classes as well. For a similar patent, they might be a good choice.