Priority Date: 04.11.13 (DE 201310222307)

Micro electro-mechanical sensor assembly having damping layer and method for producing said micro electro-mechanical sensor assembly

  • Application ID: EP14189209
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

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Specialization

This patent has the IPC class B81 (MICRO-STRUCTURAL TECHNOLOGY) is specialized in B81. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 04.11.2013 - Priority Date (DE 201310222307)
  • 06.05.2015 - Publication A1 (EP2868625)

IPC Classification