Priority Date: 06.12.13 (US 201314099768)

Packaged semiconductor device with interior polygonal pads

  • Application ID: EP14188355
  • Status: EXAMINATION IN PROGRESS

Applicant

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Technology Company

Attorneys

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Technology Company
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2 offices
Technology Company
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3 offices
Technology Company
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2 offices
Technology Company

Specialization

This patent has the IPC class H01 (BASIC ELECTRIC ELEMENTS) is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 06.12.2013 - Priority Date (US 201314099768)
  • 10.06.2015 - Publication A2 (EP2881984)
  • 08.07.2015 - Publication A3 (EP2881984)

IPC Classification