Priority Date: 08.10.13 (DE 20131016666)

Wafer production method

  • Application ID: EP14188186
  • Status: PATENT GRANTED

Applicant

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Specialization

This patent has the IPC combination B23, B28, and H01 is specialized in the combination B23, B28, and H01. We found, that Patentbüro Paul Rosenich AG, Baur & Weber Patentanwälte PartG mbB are specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 08.10.2013 - Priority Date (DE 20131016666)
  • 15.04.2015 - Publication A2 (EP2859985)
  • 12.08.2015 - Publication A3 (EP2859985)
  • 28.12.2016 - Publication B1 (EP2859985)