Priority Date: 11.10.13 (JP 20130213489)

Substrate processing apparatus and substrate processing method

  • Application ID: EP14188160
  • Status: PATENT GRANTED

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Specialization

This patent has the IPC class B24 (GRINDING; POLISHING) is specialized in B24. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 11.10.2013 - Priority Date (JP 20130213489)
  • 15.04.2015 - Publication A1 (EP2859993)
  • 31.08.2016 - Publication B1 (EP2859993)