Priority Date: 15.10.13 (US 201361961445P)

Method and apparatus of growing metal-free and low stress thick film of diamond-like carbon

  • Application ID: EP14188154
  • Status: EXAMINATION REQUESTED

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Specialization

This patent has the IPC class C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) is specialized in C23. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 15.10.2013 - Priority Date (US 201361961445P)
  • 22.04.2015 - Publication A1 (EP2862955)