Priority Date: 28.10.09 (US 20090607396)

Thermal conduction principle and device for intercrossed structure having different thermal characteristics

  • Application ID: EP14185010
  • Status: GRANT OF PATENT INTENDED

Attorneys

no operation time available
Headquarter in London and 6 offices
active in Legal Services, IP Consulting, and IP Portfolio Processing
no operation time available
Headquarter in London and 6 offices
active in Legal Services, IP Consulting, and IP Portfolio Processing

Specialization

This EP application has the IPC combination A47, F28, and H01. We found, that Katscher Habermann, Hofmann & Fechner, Agile IP LLP, IXAS Conseil, Turun Patenttitoimisto Oy are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 28.10.2009 - Priority Date (US 20090607396)
  • 08.04.2015 - Publication A1 (EP2857787)