Method for producing a housing assembly, housing assembly and ram device
- Application ID: EP14183869
- Status: █ EXAMINATION REQUESTED
This EP application has the IPC combination B21, B23, and H02. We found, that Patentbüro Paul Rosenich AG, Cohausz Hannig Borkowski Wißgott Patentanwaltskanzlei GbR, Rüger Barthelt Abel, Patentanwalt Prof. Haverkamp, Siemens AG and 1 other are specialized in this combination either. For a similar patent, they might be a good choice.