Method for producing a housing assembly, housing assembly and ram device
- Application ID: EP14183869
- Status: █ EXAMINATION REQUESTED
This patent has the IPC combination B21, B23, and H02 is specialized in the combination B21, B23, and H02. We found, that Patentbüro Paul Rosenich AG, Keller & Partner Patentanwälte AG, Cohausz Hannig Borkowski Wißgott Patentanwaltskanzlei GbR, Rüger Barthelt Abel, Alistair Hamilton Intellectual Property (AHIP) and 1 other are specialized in all of these IPC classes. For a similar patent, they might be a good choice.