Priority Date: 09.09.13 (JP 20130186732)

Semiconductor device with a bonding layer with a region comprising Ti and a region comprising Sn but with substantially no region comprising both Ti and Sn and method for manufacturing the same

  • Application ID: EP14176759
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

Applicant

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operating since 1887
Headquarter in London and 16 offices
active in Legal Services, IP Consulting, and Matchmaking and Trading

Specialization

This patent has the IPC class H01 (BASIC ELECTRIC ELEMENTS) is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 09.09.2013 - Priority Date (JP 20130186732)
  • 08.04.2015 - Publication A2 (EP2858107)
  • 21.10.2015 - Publication A3 (EP2858107)

IPC Classification