Priority Date: 10.07.13 (US 201313938629)

Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same

  • Application ID: EP14176155
  • Status: GRANT OF PATENT INTENDED

Attorney

operating since 2009
Headquarter in Lyngby and 1 office
active in Legal Services, IP Consulting, and IP Portfolio Processing

Specialization

This patent has the IPC class H01 (BASIC ELECTRIC ELEMENTS) is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 10.07.2013 - Priority Date (US 201313938629)
  • 14.01.2015 - Publication A1 (EP2824778)

IPC Classification