Priority Date: 27.06.13 (US 201313929346)

Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications

  • Application ID: EP14174709
  • Status: PATENT GRANTED

Applicant

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Specialization

This EP application has the IPC class C09 (DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Engel Patentanwaltskanzlei, Hoffmann Eitle PartmbB, Ter Meer Steinmeister & Partner PartGmbB, Stolmár & Partner Patentanwälte PartG mbB, Abrema Agence Brevets & Marques and 28 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 27.06.2013 - Priority Date (US 201313929346)
  • 31.12.2014 - Publication A1 (EP2818526)
  • 22.06.2016 - Publication B1 (EP2818526)

IPC Classification