Laminated chip electronic component and board for mounting the laminated component
- Application ID: EP14174616
- Status: █ PATENT GRANTED
This patent has the IPC combination H01 (BASIC ELECTRIC ELEMENTS) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR) is specialized in the combination H01 and H05. We found, that Riechelmann & Carlsohn GbR, Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte, Grünecker Patent- und Rechtsanwälte PartG mbB, Novagraaf, Santarelli and 46 others are specialized in all of these IPC classes. For a similar patent, they might be a good choice.