Priority Date: 02.08.06 (DE 20061036403)

Method and device for coating a substrate with a defined distribution of coating thickness

  • Application ID: EP14172439
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

Applicant

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Technology Company

Attorney

Employment test 11 - 50 employees
Company dna lippert stachow and partner
no operation time available
Headquarter in Bergisch Gladbach and 5 offices
active in Legal Services

Specialization

This EP application has the IPC class C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Kailuweit & Uhlemann, Bird Go├źn & Co NV, Troesch Scheidegger Werner AG, adares Reininger & Partner, Kanzlei Kempkens and 22 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 02.08.2006 - Priority Date (DE 20061036403)
  • 29.10.2014 - Publication A1 (EP2797103)

IPC Classification