Method and device for coating a substrate with a defined distribution of coating thickness
- Application ID: EP14172439
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
This EP application has the IPC combination C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Kailuweit & Uhlemann, Riechelmann & Carlsohn GbR, Patentanwälte Rauschenbach, Bird Goën & Co NV, Troesch Scheidegger Werner AG and 25 others are specialized in this combination either. For a similar patent, they might be a good choice.