Priority Date: 10.04.13 (US 201313860044)

Architectures for high temperature TBCs with ultra low thermal conductivity and abradability and method of making

  • Application ID: EP14163745
  • Status: EXAMINATION IN PROGRESS

Applicant

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Technology Company

Attorneys

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Technology Company
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Technology Company
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Technology Company

Specialization

This patent has the IPC combination C04, C23, and F01 is specialized in the combination C04, C23, and F01. There is no patent agent firm in the market, which is specialized in this combination of IPC classes.

Timeline

  • 10.04.2013 - Priority Date (US 201313860044)
  • 05.11.2014 - Publication A2 (EP2799588)
  • 29.04.2015 - Publication A3 (EP2799588)