Priority Date: 26.09.06 (US 20060848043P)

Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane

  • Application ID: EP14162185
  • Status: EXAMINATION IN PROGRESS

Attorney

Employment test 11 - 50 employees
Company dna ter meer steinmeister and partner gbr
operating since 1973
Headquarter in Munich and 2 offices
active in Legal Services

Specialization

This patent has the IPC class H01 (BASIC ELECTRIC ELEMENTS) Ter Meer Steinmeister & Partner PartGmbB is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 26.09.2006 - Priority Date (US 20060848043P)
  • 02.07.2014 - Publication A2 (EP2750177)
  • 22.10.2014 - Publication A3 (EP2750177)