Priority Date: 28.03.13 (US 201313852876)

Embedded die-down package-on-package device

  • Application ID: EP14161193
  • Status: GRANT OF PATENT INTENDED

Applicant

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Technology Company

Attorneys

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Specialization

This patent has the IPC class H01 (BASIC ELECTRIC ELEMENTS) is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 28.03.2013 - Priority Date (US 201313852876)
  • 24.12.2014 - Publication A1 (EP2816596)