Priority Date: 26.04.13 (JP 20130094357)

Cu-diamond based solid phase sintered body having excellent heat resistance, heat sink using the same, electronic device using the heat sink, and method for producing Cu-diamond based solid phase sintered body

  • Application ID: EP14160218
  • Status: EXAMINATION REQUESTED

Applicant

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Specialization

This patent has the IPC combination B22, C22, and H01 is specialized in the combination B22, C22, and H01. We found, that Diehl & Partner GbR is specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 26.04.2013 - Priority Date (JP 20130094357)
  • 29.10.2014 - Publication A1 (EP2796579)