Cu-diamond based solid phase sintered body having excellent heat resistance, heat sink using the same, electronic device using the heat sink, and method for producing Cu-diamond based solid phase sintered body
- Application ID: EP14160218
- Status: █ EXAMINATION REQUESTED
This EP application has the IPC combination B22, C22, and H01. We found, that Diehl & Partner GbR, PRÜFER & PARTNER mbB, Heraeus Holding GmbH, Element Six Ltd, Plansee Group Service GmbH and 1 other are specialized in this combination either. For a similar patent, they might be a good choice.