Priority Date: 15.03.13 (JP 20130053812)

Semiconductor device with a chip bonded to a lead frame with a sintered Ag layer, wherein a resin fillet covers the sintered Ag layer and a part of a side surface of the chip and wherein chip electrodes are bonded to leads, as well as method of manufacturing the same

  • Application ID: EP14160005
  • Status: EXAMINATION IN PROGRESS

Applicant

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Specialization

This EP application has the IPC class H01 (BASIC ELECTRIC ELEMENTS). Mewburn Ellis LLP is specialised in H01 (BASIC ELECTRIC ELEMENTS). Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 15.03.2013 - Priority Date (JP 20130053812)
  • 17.09.2014 - Publication A2 (EP2779232)
  • 03.12.2014 - Publication A3 (EP2779232)