Priority Date: 14.03.13 (US 201313826614)

Chip package connector assembly

  • Application ID: EP14158391
  • Status: GRANT OF PATENT INTENDED

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Specialization

This patent has the IPC class H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR) is specialized in H05. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 14.03.2013 - Priority Date (US 201313826614)
  • 17.09.2014 - Publication A2 (EP2779812)
  • 15.04.2015 - Publication A3 (EP2779812)

IPC Classification