Priority Date: 13.03.13 (US 201313801822)

Coreless substrate with passive device pads

  • Application ID: EP14158382
  • Status: GRANT OF PATENT INTENDED

Applicant

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Specialization

This EP application has the IPC combination H01 (BASIC ELECTRIC ELEMENTS) and H05 (ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR). We found, that Riechelmann & Carlsohn GbR, Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte, AWA, Grünecker Patent- und Rechtsanwälte PartG mbB, advotec. and 42 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 13.03.2013 - Priority Date (US 201313801822)
  • 22.10.2014 - Publication A1 (EP2793262)