Priority Date: 15.10.09 (JP 20090238518)

Power semiconductor element bonded to a substrate by a Sn-Sb-Cu solder and manufacturing method therefor

  • Application ID: EP14156808
  • Status: GRANT OF PATENT INTENDED

Attorney

Employment test 51 - 200 employees
Company dna prufer and partner gbr
operating since 1972
Headquarter in Munich
active in Legal Services and IP Consulting

Specialization

This patent has the IPC combination B23, C22, and H01 is specialized in the combination B23, C22, and H01. We found, that Beetz & Partner is specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 15.10.2009 - Priority Date (JP 20090238518)
  • 02.07.2014 - Publication A2 (EP2750173)
  • 24.09.2014 - Publication A3 (EP2750173)