Priority Date: 15.10.09 (JP 20090238518)

Power semiconductor element bonded to a substrate by a Sn-Sb-Cu solder and manufacturing method therefor

  • Application ID: EP14156808
  • Status: GRANT OF PATENT INTENDED

Attorney

Employment test 51 - 200 employees
Company dna prufer and partner gbr
operating since 1972
Headquarter in Munich
active in Legal Services and IP Consulting

Specialization

This EP application has the IPC class B23, C22, and H01. We found, that Beetz & Partner, WIRNSBERGER & LERCHBAUM Patentanwälte OG are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 15.10.2009 - Priority Date (JP 20090238518)
  • 02.07.2014 - Publication A2 (EP2750173)
  • 24.09.2014 - Publication A3 (EP2750173)