Substrate assembly of heterogeneous materials and method for making the same
- Application ID: EP14152458
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
This EP application has the IPC combination B32 (LAYERED PRODUCTS) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Riechelmann & Carlsohn GbR, Hoffmann Eitle PartmbB, Ter Meer Steinmeister & Partner PartGmbB, Freischem & Partner Patentanwälte mbB, Koepe & Partner Patentanwälte and 18 others are specialized in this combination either. For a similar patent, they might be a good choice.