Substrate assembly of heterogeneous materials and method for making the same
- Application ID: EP14152458
- Status: █ APPLICATION DEEMED TO BE WITHDRAWN
This patent has the IPC combination B32 (LAYERED PRODUCTS) and H01 (BASIC ELECTRIC ELEMENTS) is specialized in the combination B32 and H01. We found, that Riechelmann & Carlsohn GbR, Hoffmann Eitle PartmbB, Ter Meer Steinmeister & Partner PartGmbB, Freischem & Partner Patentanwälte mbB, Koepe & Partner Patentanwälte and 11 others are specialized in all of these IPC classes. For a similar patent, they might be a good choice.