Plant and method for sputtering a substrate using a dopant material

  • Application ID: EP14150634
  • Status: PATENT GRANTED

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Specialization

This patent has the IPC combination C03, C22, and C23 is specialized in the combination C03, C22, and C23. There is no patent agent firm in the market, which is specialized in this combination of IPC classes.

Timeline

  • 15.07.2015 - Publication A1 (EP2894134)
  • 25.05.2016 - Publication B1 (EP2894134)