Priority Date: 08.05.13 (JP 20130098747)

Method for forming a resist under layer film and patterning process

  • Application ID: EP14001569
  • Status: NO OPPOSITION FILED WITHIN TIMELIMIT

Applicant

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Specialization

This EP application has the IPC combination G03 (PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Kuhnen & Wacker, Hoffmann Eitle PartmbB, Klunker Schmitt-Nilson Hirsch Patentanwälte (KSNH) Klunker IP Patentanwälte PartG mbB, Bird Goën & Co NV, Becker Kurig Straus and 8 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 08.05.2013 - Priority Date (JP 20130098747)
  • 24.12.2014 - Publication A1 (EP2816409)
  • 06.01.2016 - Publication B1 (EP2816409)

IPC Classification