Method for forming a resist under layer film and patterning process
- Application ID: EP14001569
- Status: █ NO OPPOSITION FILED WITHIN TIMELIMIT
This patent has the IPC combination G03 (PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY) and H01 (BASIC ELECTRIC ELEMENTS) is specialized in the combination G03 and H01. We found, that Kuhnen & Wacker, Hoffmann Eitle PartmbB, Bird Goën & Co NV, Becker Kurig Straus, Beetz & Partner and 11 others are specialized in all of these IPC classes. For a similar patent, they might be a good choice.