Priority Date: 31.01.13 (CN 2013139004)

CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD

  • Application ID: EP13830196
  • Status: GRANT OF PATENT INTENDED

Applicant

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Technology Company

Attorney

operating since 1951
Headquarter in Munich and 2 offices
active in Legal Services, IP Consulting, and IP-related Communication Service

Specialization

This patent has the IPC class H01 (BASIC ELECTRIC ELEMENTS) isarpatent Behnisch Barth Charles Hassa Peckmann & Partner mbB is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 31.01.2013 - Priority Date (CN 2013139004)
  • 07.08.2014 - Publication A1 (WO2014117495)
  • 01.10.2014 - Publication A1 (EP2784810)

IPC Classification