Priority Date: 10.08.12 (JP 20120178846)

HIGH-TEMPERATURE LEAD-FREE SOLDER ALLOY

  • Application ID: EP13828210
  • Status: PATENT GRANTED

Applicant

Technology company logo small
Technology Company

Attorney

Employment test 11 - 50 employees
Company dna zimmermann and partner
no operation time available
Headquarter in Munich and 2 offices
active in Legal Services, IP Consulting, and Matchmaking and Trading

Specialization

This EP application has the IPC class B23, C22, and H05. We found, that Berendt Leyh & Hering, Patentanwalt Prof. Haverkamp are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 10.08.2012 - Priority Date (JP 20120178846)
  • 13.02.2014 - Publication A1 (WO2014024715)
  • 17.06.2015 - Publication A1 (EP2883649)
  • 19.04.2017 - Publication B1 (EP2883649)