Priority Date: 09.07.12 (JP 20120154124)

COPPER FILM-FORMING AGENT AND METHOD FOR FORMING COPPER FILM

  • Application ID: EP13816923
  • Status: EXAMINATION REQUESTED

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Specialization

This EP application has the IPC combination C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) and H01 (BASIC ELECTRIC ELEMENTS). We found, that Kailuweit & Uhlemann, Patentanwälte Rauschenbach, ip21 Ltd, Troesch Scheidegger Werner AG, Kanzlei Kempkens and 25 others are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 09.07.2012 - Priority Date (JP 20120154124)
  • 16.01.2014 - Publication A1 (WO2014010328)
  • 13.05.2015 - Publication A1 (EP2871260)

IPC Classification