Priority Date: 27.06.12 (JP 20120144652)

ELECTRONIC COMPONENT METAL MATERIAL AND MANUFACTURING METHOD THEREOF, AND CONNECTOR TERMINAL, CONNECTOR AND ELECTRONIC COMPONENT USING SAID ELECTRONIC COMPONENT METAL MATERIAL

  • Application ID: EP13809664
  • Status: The patent has been granted

Applicant

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Specialization

This patent has the IPC combination C22, C25, and H01 is specialized in the combination C22, C25, and H01. We found, that Yeadon IP Ltd is specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 27.06.2012 - Priority Date (JP 20120144652)
  • 03.01.2014 - Publication A1 (WO2014003145)
  • 06.05.2015 - Publication A1 (EP2868776)
  • 17.05.2017 - Publication B1 (EP2868776)