FLUX COMPOSITION, LIQUID FLUX, RESIN FLUX CORED SOLDER, AND SOLDER PASTE
- Application ID: EP13804256
- Status: █ GRANT OF PATENT INTENDED
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- 11.06.2012 - Priority Date (JP 20120132095)
- 19.12.2013 - Publication A1 (WO2013187363)
- 22.04.2015 - Publication A1 (EP2862667)