Priority Date: 12.06.12 (US 201261658788P)

METHOD FOR APPLYING A FINAL METAL LAYER FOR WAFER LEVEL PACKAGING AND ASSOCIATED DEVICE

  • Application ID: EP13804061
  • Status: APPLICATION DEEMED TO BE WITHDRAWN

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Specialization

This patent has the IPC class H01 (BASIC ELECTRIC ELEMENTS) is specialized in H01. Here you find a list of all patent agent firms which are specialized in this IPC class. For a similar patent, they might be a good choice.

Timeline

  • 12.06.2012 - Priority Date (US 201261658788P)
  • 19.12.2013 - Publication A1 (WO2013188156)
  • 03.06.2015 - Publication A1 (EP2878010)

IPC Classification