Priority Date: 09.11.12 (EP 20120192091)

METHOD FOR BONDING BARE CHIP DIES

  • Application ID: EP13801876
  • Status: GRANT OF PATENT INTENDED

Applicants

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operating since 1916
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Specialization

This EP application has the IPC combination B23, C09, and H01. We found, that Berendt Leyh & Hering, Gille Hrabal, Hössle Patentanwälte, Octrooibureau Griebling BV, Chemetall GmbH are specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 09.11.2012 - Priority Date (EP 20120192091)
  • 15.05.2014 - Publication A1 (WO2014073963)
  • 16.09.2015 - Publication A1 (EP2917931)