Priority Date: 12.11.12 (JP 20120248723)

PRETREATMENT METHOD FOR PARTIAL PLATING, PARTIAL PLATING METHOD FOR ALUMINUM MATERIALS, AND RESIST FOR PLATING ALUMINUM MATERIALS

  • Application ID: EP13798727
  • Status: EXAMINATION IN PROGRESS

Applicants

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Technology Company

Attorney

Employment test 11 - 50 employees
Company dna kuhnen and wacker
operating since 1976
1014.21
Headquarter in Freising
active in Legal Services

Specialization

This patent has the IPC combination C23 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL) and C25 (ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR) is specialized in the combination C23 and C25. We found, that Charrier Rapp & Liebau, Papula Oy, Yeadon IP Ltd, Patentanwaltskanzlei Scheffler are specialized in all of these IPC classes. For a similar patent, they might be a good choice.

Timeline

  • 12.11.2012 - Priority Date (JP 20120248723)
  • 15.05.2014 - Publication A1 (WO2014072800)
  • 01.07.2015 - Publication A1 (EP2888389)