THIN PLATE HAVING EXCELLENT CORROSION RESISTANCE, ELECTROCONDUCTIVITY, AND MOLDABILITY, AND METHOD FOR MANUFACTURING SAME
- Application ID: EP13796440
- Status: █ GRANT OF PATENT INTENDED
This patent has the IPC combination C22, C23, and H01 is specialized in the combination C22, C23, and H01. We found, that Patentanwälte Rauschenbach, Zimmermann & Partner Patentanwälte mbB, Cremer & Cremer, Yeadon IP Ltd are specialized in all of these IPC classes. For a similar patent, they might be a good choice.