Priority Date: 18.07.12 (US 201261672808P)

METHOD OF SOLDERING AN ELECTRONIC COMPONENT WITH A HIGH LATERAL ACCURACY

  • Application ID: EP13774507
  • Status: GRANT OF PATENT INTENDED

Applicants

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Technology Company
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Technology Company

Attorneys

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Technology Company
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Technology Company

Specialization

This EP application has the IPC class B23, C22, and H05. We found, that Berendt Leyh & Hering is specialized in this combination either. For a similar patent, they might be a good choice.

Timeline

  • 18.07.2012 - Priority Date (US 201261672808P)
  • 23.01.2014 - Publication A2 (WO2014013463)
  • 27.05.2015 - Publication A2 (EP2874780)